technologyProduct Technology
Product TechnologyINFORMATION
We provide detailed technical information on the products and services offered by Oume Electronics.
This includes service lineups, supported specifications, case studies, and other helpful resources for selecting the right products.
Service LineupSERVICES
WLCSP PKG
(Wafer‑Level Chip Size Package)
Package for Ultra‑Compact, Ultra‑Thin Devices
WLCSP is an ultra‑small, ultra‑thin semiconductor package whose dimensions are nearly equal to the bare die.
It is ideal for applications requiring miniaturization, such as smartphones, wearable devices, IoT sensors, and other compact electronics.
Provided Information
- Lineup (package variations)
- Reliability Data
- Application Guidelines (assembly methods, recommended pad diameter)
Bumping service
High‑Quality Bump Formation for Enhanced Assembly Reliability
We provide bump formation services compatible with various bump structures such as solder bumps and Cu pillars.
Existing wafers supplied by customers can be processed for bumping, making the service suitable for FC‑BGA, FC‑CSP, and other flip‑chip applications.
Provided Information
- Lineup (package variations)
- Case Examples (implementation examples within the AOI Electronics Group)
Support from the Early Design StageSUPPORT
If you need assistance with product selection or specifications, please feel free to contact us.
Our technical staff will propose the most suitable solution for your needs.