Oume Electronics Co., Ltd. - Oume Electronics utilizes rare WLP (Wafer Level Package) technology, which is incorporated into mobile devices worldwide, to achieve high-density semiconductor packaging, miniaturization, and enhanced performance. Leveraging the R&D capabilities we have cultivated since our founding and the comprehensive strengths of the Aoi Electronics Group, we contribute to cutting-edge technologies that will support the future—such as IoT and 5G—and have earned the deep trust of manufacturers both in Japan and abroad.

CONCEPT

Supporting devices around
the world with rare WLCSP

Supporting global devices with
WLCSP technology and contributing to

What is WLCSP?ABOUT US

WLCSP is an abbreviation for Wafer Level Chip Size Package, and it is a chip-size package that is completed by processing up to the final packaging step while still in the wafer state (level).
Compared to conventional technology, it is expected to offer miniaturization, thinning, and benefits for mass production.

Miniaturization and thinning

We provide best solutions
for mobile devices and the like.
Economies of scale

Batch processing at the wafer level
improves productivity.
Performance enhancement

By shortening the wiring length,
high-speed operation and low power consumption
can be achieved simultaneously.

WLCSP technology is being used in a place like this.WLCSP IN ACTION

Mobile devices such as smartphonesMOBILE DEVICES

Wearable deviceWEARABLES

IoT devices and sensorsIoT & SENSORS

Reasons why Oume Electronics is chosenWHY OUME ELECTRONICS

REASONS01

The Comprehensive Strength of Aoi Electronics Group

Leveraging the technical capabilities and network of our group companies, we provide an integrated support system from design to mass production.

REASONS02

Optimization of the production process

Based on customer requirements, we leverage our accumulated experience and technologies to propose optimal structures and processes, and provide high-quality, cost-effective packaging solutions.

REASONS03

Extensive lineup

We operate production lines capable of handling 6-, 8-, and 12-inch wafer flows, offering a wide range of variations—including our proprietary structures—to meet our customers’ diverse needs.

Business discriptionBUSINESS

BUSINESS01Mass production

Based on specifications and production conditions verified through prototyping, we deliver stable, high-quality, and cost-effective mass production.

BUSINESS02Prototype

We propose optimal structures and processes and support you from prototype development to mass production. Please feel free to contact us regarding prototyping for process development or material evaluation.

BUSINESS03TEG

For evaluation samples, we can propose multiple TEG options that can be used without the need for dedicated tooling. Please use them to help reduce evaluation costs.

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Product TechnologyPRODUCT

PRODUCT01WLCSP

Oume Electronics' WLCSP lineup consists of three types. Two structural types and one application form.
Among them, the Cu POST type, which we have been producing for many years as our major structure, is a package format adopted worldwide, even though our company is currently the only factor.
We would like to introduce our WLCSP.

PRODUCT02Bumping service

This is a service using our plating bump process, which has been a core of our company since its founding.
In flip-chip assembly, we form the fine bumps that are essential, so please use it according to customer needs.

View Product Technology Information

RECRUIT INFORMATIONRECRUIT

Shall we create the technology of the future together?

At Oume Electronics, we are looking for colleagues who will lead the world with WLCSP technology.

RECRUIT INFORMATION