bumping serviceBumping Service
Bump formation on customer‑supplied wafers for board‑embedded, module‑embedded, and flip‑chip applications.PROCESSING
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We propose the optimal bump structures according to your application and assembly method.
Solder‑Plated Bumps
Features
- Solder bumps are formed on pads using a plating process
- Enables fine-pitch terminal formation
Bump Materials
- Ni/SnAg
Supported Specifications
- Wafer sizes: 6, 8, 12 inch
- Bump diameter: ≥ 12 µm
- Bump height: ≥ 10 µm
- Bump pitch: ≥ 27 µm
Applications
- C-MOS sensor
- Thermal Driver
Cu Pillar
Features
- Cu pillar and SnAg bumps are formed using a plating process
- Suitable for fine‑pitch applications
- Ideal for applications requiring clearance from the mounting substrate
Bump Materials
- Cu/(Ni)/SnAg
Supported Specifications
- Wafer sizes: 6, 8, 12 inch
- Pillar diameter: ≥ 12 µm
- Pillar height: approx. 13 µm to 80 µm
- Pillar pitch: ≥ 27 µm
- Cu pillar bumping can also be combined with RDL processing.
Applications
- DC/DC Converter
- Antenna SW
- e Fuse
- Optical Communication
- Mobile phone
- Wearable
- Battery
- Automotive
- MOS-FET
- 5G
- Base Stations
ApplicationsCASE
Oume Electronics’ bumping services are used across a wide range of applications.
Camera Image Sensors
Solder‑Plated Bumps
Thermal Print Head Drivers
Solder‑Plated Bumps
Aoi Electronics FOLP
Cu Pillar
Fine‑Pitch Cu Pillar
For FOLP® PSB
