Oume Electronics Co., Ltd.

mass productionMass Production

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Providing Seamless Services from Wafer Processing to SingulationWAFER PROCESSING

We offer wafer singulation services to return fully processed chips to our customers.
Within the AOI Electronics Group, we provide an integrated workflow covering wafer processing, singulation, testing, and taping.
Partial process support is also available upon request.

Providing Seamless Services from Wafer Processing to Singulation

Benefits of Turnkey Services

Single Point of Contact

Simplifies coordination and reduces administrative workload.

Unified Quality Control

Prevents miscommunication between processes and reduces quality issues.

Short Lead Times

Minimizes waiting time between manufacturing processes.

Cost Optimization

Improves overall competitiveness through total cost reduction.

一貫のメリット Benefits of Turnkey Services

Turnkey Flow in Mass ProductionFLOW

Processes by OUME ELECTRONICS

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Receiving

Customers provide wafers in process along with the associated wafer data.
Wafer data can also be exchanged via our secure server system.

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Wafer Processing

Wafer-level packaging and bumping processes are performed.
Chip-level visual inspection using map data is also available.

Key Processes

  • Insulation layer formation
  • Redistribution layer (RDL) formation
  • Cu Post/Cu UBM形成（WLCSP）
  • Resin encapsulation (CP type)
  • Terminal formation (ball mounting / solder bumps / Cu pillars)
  • Back grinding (thinning)
  • Laser marking
  • Dicing (singulation)

For details on each process, please visit the product technology page.

View Product Technology Information

Processes by AOI ELECTRONICS and HIGH COMPONENTS AOMORI

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Electrical Testing

Electrical testing is conducted at Aoi Electronics and High Components Aomori.

Test Items

  • Electrical characteristics measurement
  • Functional testing
  • Defect screening

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Packaging

Qualified products are packaged at Aoi Electronics and High Components Aomori.
Packaging formats include taping (reel winding) and tray packing.

Available Packaging Formats

  • Tape & reel / chip tray
  • Wafer
    Note: Other packaging formats are available upon request.

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Shipping

We ship the products to the customer‑designated location.

If you need assistance with WLCSP mass production, please feel free to contact us.
We will provide an optimal production setup tailored to your requirements.