businessBusiness
Our BusinessABOUT OUR BUSINESS
Ome Electronics specializes in semiconductor packaging solutions centered on Wafer Level Chip Size Package (WLCSP) technology.
From developing optimized packaging and processes—balancing production cost, quality, and turnaround time—to supporting everything from prototyping to mass production, we deliver comprehensive solutions tailored to our customers’ needs.
Mass production
Turnkey Mass-Production System
Based on the specifications and production conditions verified in the prototype, we can reasonably provide a stable mass production flow in terms of quality and production.
In addition, it is also possible to provide comprehensive services such as individual chip handling, testing, and taping by the Aoi Electronics Group.
Main Services
- WLCSP processing and assembly
- Bumping services
- Redistribution layer (RDL) formation
- Back grind
- Dicing※
- Testing and taping※
※This is an integrated service provided by the Aoi Electronics Group.
Prototype
Proposing the Optimal Process Design
We will understand our customers' needs, compare them with our process structure and materials, and make proposals.
Please feel free to contact us about prototypes for purposes such as process development and material evaluation.
Main Services
- Structural studies, product design
- Process flow design
- Prototype flow, prototype result reports
- Feedback on prototype results
- Analysis support
- Simulation services
TEG
Support for Small-Volume Production
For the evaluation samples, we have prepared several TEGs that can be used without creating jigs or tools.
Please make use of them to help reduce the costs associated with the evaluation.
Main Services
- Prototype support for basic evaluation
- Partial process consignment services
- Provision of owned TEG patterns
- Design support for evaluation circuit patterns
