CU Pillar&半田Bump
| Typical | 2016 | 2017 | 2018 | |||||
|---|---|---|---|---|---|---|---|---|
| Pitch | 12inch | 8inch | 12inch | 8inch | 12inch | 8inch | 12inch | 8inch |
| 250 | 40 | 80 | 30 | 60 | 20 | 40 | 20 | |
| アスペクト比 | 1.0 | 1.0 | 2.0 | 2.0 | 2.0 | 2.5 | 2.5 | 2.5 |
| （高さ÷径） | ||||||||
| 最小端子径 | 80 | 40 | 40 | 20 | 35 | 15 | 25 | 15 |
| 最大端子高さ | 80 | 40 | 80 | 70 | 80 | 70 | 80 | 70 |
| 端子構造 | SnAg/Ni/Cu | SnAg/Ni/Cu | SnAg/Ni/Cu SnAg/Cu |
SnAg/Ni/Cu SnAg/Cu |
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