Production lineup

Type	特徴
POST Type	■ Complete protection chip (Back side lamination is available) ■ High reliability (PKG level , Board level)
RDL Type	■ Acceptable Low-k & U-Low-K ■ Power/High Current Device (~ 10mm,800pins) Device (Under Development)) (Back side lamination is available) ■ CIS/MEMS (Under Development)
So Ball Type	■ Solder Ball structure ■ Mounting reliability ■ Small~ Middle size (0.5 ~ 6mm) ■ Multi purpose device
Cu Pillar Type	■ For fine pitch flip chip ■ Small ~ large size.
For EWLP	■ Embedded PCB ■ Embedded KGD ■ Ultra Flat Structure ■ High Stability ■ Familiar with Board Material