Roadmap
| Item | Typical | 2016 | 2017 | 2018 | technology | |
|---|---|---|---|---|---|---|
| Max. Die Size (√X*Y) [mm] | 6 | 12 | 15 | 15 | ・New solder ball for high reliability | |
| Min. Die Size (√X*Y) [mm] | 1.0 | 0.5 | <0.5 | <0.5 | ・New grinding tape for Min. Die size | |
| Cu Redistribution Min. Line/Space [μm] | 15/20 | 10/10 | <10/10 | <5/5 | ・New photo resist for Cu redistribution | |
| Cu Redistribution max. Thickness [μm] | 5 - 7 | 12 | >15 | >15 | ||
| Scribe Line Width Min.[μm] | 100 | 60 | 50 | 50 | ・Dicing Equipment Remodeling | |
| Option | ||||||
| Body Min. Thickness [μm] (Normal) | 550 - 400 | 300 | <250 | <250 | ・New encapsulation resin for a low residual stress | |
| Body Min. Thickness [μm] (DBG) | 200 | 80 | <80 | <80 | ・Stress release / New back grind tape | |
| Max. Repassivation Thickness [μm] | 4 - 6 | 12 | 15 | >15 | ・Development of Negative Polyimide | |
| Narrow Pitch | 0.4 | 0.2 | 0.15 | <0.15 | ・Solder Ball / U1 structure / Cu pillar | |
| Max. Process Temp. [degree C] | 350 | 250 | 230 | 230 | ・New repassivation material for low temp and low residual stress Except for reflow process as it is short time. |
|
| Solder Ball Size [μm] | 200 | 90 | 80 | 60 | ・Equipment for small ball / Improvement of ball mask | |
| Dry Polish | 12/8inch | 12/8inch | 12/8inch | ・transverse strength improvement (marking load) | ||
