CP Type structure

WLP Type	Standard Type	Thin Type
1) Solder Terminal Height [μm]	150 - 250	80 (Max.)
2) Cu Post Diameter [μm]	100 - 250
3) Epoxy Thickness [μm]	50 - 70	40 - 50
4) Cu Redistribution Line / Space [μm] (Min.)	10 / 10
5) PI Thickness [μm]	4 - 15
6) Body Thickness [μm]	300 - 400以上	80 - 300

Reliability Test Result