Cu Pillar & Solder Bump

[unit : μｍ]

	Typical		2016		2017		2018
Pitch	12inch	8inch	12inch	8inch	12inch	8inch	12inch	8inch
	250	40	80	30	60	20	40	20
Aspect Ratio	1.0	1.0	2.0	2.0	2.0	2.5	2.5	2.5
（Height / Diameter）
Min. Terminal Diameter	80	40	40	20	35	15	25	15
Max. Terminal Height	80	40	80	70	80	70	80	70
Terminal Structure	SnAg/Ni/Cu		SnAg/Ni/Cu		SnAg/Ni/Cu SnAg/Cu		SnAg/Ni/Cu SnAg/Cu