Company History

• 1987.Jul.Company formation (Casio Micronics start up)
• 1997.Jul.Solder BUMP (5,6 inch wafer) production start
• 2000.Mar.ISO14001 certification accession
• 2001.May.W-CSP (5,6,8 inch wafer) production start
• 2003.Sep.ISO9001 certification accession
• 2005.Jan.W-CSP & Solder BUMP (12 inch wafer) production start
• 2011.Oct.Company name changed to "Teramikros" (Affiliated company of Teraprobe)
• 2013.Oct.Teraprobe merged Teramikros
• 2016.Apr.Transferred to AOI ELECTRONICS CO.,LTD.
•                  Company name changed to "OUME ELECTRONICS CO.,LTD." (100% subsidiary of AOI ELECTRONICS CO.,LTD.)

Technology Evolution