Since our establishment in 1987, we have been striving to improve our BUMP technology, proposing semiconductor packages that meet the needs of the times and providing a wide range of products to customers around the world.

The semiconductor industry is rapidly changing, and the stage of competition is expanding from Japan to the world. All of us at WLCSP will do our utmost to provide services that will truly satisfy our customers, with gratitude and sincerity as our motto. As the one and only WLCSP and BUMP contract manufacturer in Japan, we will continue to grow together with you.

We look forward to your continued support and encouragement.

President Masato Fukushima