WLP structure and characteristics

WLP is short title of Wafer Level Package. It is chip size package that
produced in wafer form during full process from the first to the end.

Structure and Features

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Features
● Ultra thin type, ultra miniature, lightweight ● High reliability ● Excellent protection (Mechanical, Chemical) ● High current capacity ● Good thermal dissipation	● Assembly with conventional SMT ● Suitable for embedding 　・ Flat WLP surface 　・ No need for KGD 　・ Copper-to-copper interconnection 　・ Safe protective construction