TECHNOLOGY

Challenge for Solderless Technology

EWLP Formations

Single Package Multi Device Package (SiP,PoP,MCP,etc)

  • - Realized fan in & out type by embedding a WLP of small terminal pitch
  • - From semiconductor makers

  • - Embedding a WLP (or several WLPs) into PWB and, if necessary, combining SMT of other devices (mainly active devices).
    - One combination is to embed WLPs on the same plane. Another is to put it vertically on EWLP
    - From semiconductor & module makers
Module Solderless electronic system assembly

  • - Embedding a WLP (or several WLPs) into PWB and combining SMT like passive devices, etc.
    - From module makers

  • - Embedding WLP and passive device into PWB　　　
    - High reliability
    - Top and bottom side of PWB works as electromagnetic shield

Actual example1

　
Embedded WLP WLP
(SMT Assembly)
Size 4.46×5.21mm Size 5.42×4.80mm
Thickness 0.15mm Thickness 0.22mm(body)
I/O 270pins I/O 90pins
Pad Pitch 0.25-0.30mm Pad Pitch 0.5mm


PoP
  • - Size：9.0×11.0mm
  • - I/O：281pins
  • - Pad Pitch：0.5mm

EWLP Substrate
  • - Thickness：0.55mm
  • - L/S：30/30um

Cooperation : Former Renesus technology, Ibiden


Actual example2

・Size 6×6.5mm
・PWB Thickness 0.44mm
・Terminal height 0.26mm
・Terminal pitch 0.5mm
・I/O 119pins


For PoP WLP
  • - Size　5×2.8mm
  • - Thickness　0.27mm
    　 （Include terminal）
  • - I/O　85pins

For Embedded WLP
  • - Size　　5×3mm
  • - Thickness　　0.1mm
  • - I/O　108pins

Cooperation : CMK CORPORATION

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